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Pak-kin Mak
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2010 – 2019
- 2018
- [j9]Christian Jacobi, Anthony Saporito, Martin Recktenwald, Aaron Tsai, Ulrich Mayer, Markus M. Helms, Adam Collura, Pak-kin Mak, Robert J. Sonnelitter, Michael A. Blake, Tim Bronson, Arthur O'neill, Vesselina K. Papazova:
Design of the IBM z14 microprocessor. IBM J. Res. Dev. 62(2/3): 8:1-8:11 (2018) - 2015
- [j8]Craig R. Walters, Pak-kin Mak, Deanna Postles Dunn Berger, Michael A. Blake, Tim Bronson, K. D. Klapproth, A. J. O'Neill, Robert J. Sonnelitter, Vesselina K. Papazova:
The IBM z13 processor cache subsystem. IBM J. Res. Dev. 59(4/5) (2015) - [c3]James D. Warnock, Brian W. Curran, John Badar, Gregory Fredeman, Donald W. Plass, Yuen H. Chan, Sean M. Carey, Gerard Salem, Friedrich Schroeder, Frank Malgioglio, Guenter Mayer, Christopher J. Berry, Michael H. Wood, Yiu-Hing Chan, Mark D. Mayo, John Isakson, Charudhattan Nagarajan, Tobias Werner, Leon J. Sigal, Ricardo Nigaglioni, Mark Cichanowski, Jeffrey A. Zitz, Matthew M. Ziegler, Tim Bronson, Gerald Strevig, Daniel Dreps, Ruchir Puri, Douglas Malone, Dieter F. Wendel, Pak-kin Mak, Michael A. Blake:
4.1 22nm Next-generation IBM System z microprocessor. ISSCC 2015: 1-3 - 2014
- [j7]James D. Warnock, Yuen H. Chan, Hubert Harrer, Sean M. Carey, Gerard Salem, Doug Malone, Ruchir Puri, Jeffrey A. Zitz, Adam Jatkowski, Gerald Strevig, Ayan Datta, Anne Gattiker, Aditya Bansal, Guenter Mayer, Yiu-Hing Chan, Mark D. Mayo, David L. Rude, Leon J. Sigal, Thomas Strach, Howard H. Smith, Huajun Wen, Pak-kin Mak, Chung-Lung Kevin Shum, Donald W. Plass, Charles F. Webb:
Circuit and Physical Design of the zEnterprise™ EC12 Microprocessor Chips and Multi-Chip Module. IEEE J. Solid State Circuits 49(1): 9-18 (2014) - 2013
- [c2]James D. Warnock, Yuen H. Chan, Hubert Harrer, David L. Rude, Ruchir Puri, Sean M. Carey, Gerard Salem, Guenter Mayer, Yiu-Hing Chan, Mark D. Mayo, Adam Jatkowski, Gerald Strevig, Leon J. Sigal, Ayan Datta, Anne Gattiker, Aditya Bansal, Doug Malone, Thomas Strach, Huajun Wen, Pak-kin Mak, Chung-Lung Kevin Shum, Donald W. Plass, Charles F. Webb:
5.5GHz system z microprocessor and multi-chip module. ISSCC 2013: 46-47 - 2012
- [j6]Fadi Busaba, Michael A. Blake, Brian W. Curran, Michael F. Fee, Christian Jacobi, Pak-kin Mak, Brian R. Prasky, Craig R. Walters:
IBM zEnterprise 196 microprocessor and cache subsystem. IBM J. Res. Dev. 56(1): 1 (2012) - 2011
- [j5]Brian W. Curran, Lee Eisen, Eric M. Schwarz, Pak-kin Mak, James D. Warnock, Patrick J. Meaney, Michael F. Fee:
The zEnterprise 196 System and Microprocessor. IEEE Micro 31(2): 26-40 (2011) - [c1]James D. Warnock, Y. Chan, William V. Huott, Sean M. Carey, Michael F. Fee, Huajun Wen, Mary Jo Saccamango, Frank Malgioglio, Patrick J. Meaney, Donald W. Plass, Yuen H. Chan, Mark D. Mayo, Guenter Mayer, Leon J. Sigal, David L. Rude, Robert M. Averill III, Michael H. Wood, Thomas Strach, Howard H. Smith, Brian W. Curran, Eric M. Schwarz, Lee Eisen, Doug Malone, Steve Weitzel, Pak-kin Mak, Thomas J. McPherson, Charles F. Webb:
A 5.2GHz microprocessor chip for the IBM zEnterprise™ system. ISSCC 2011: 70-72
2000 – 2009
- 2009
- [j4]Pak-kin Mak, Craig R. Walters, Gary E. Strait:
IBM System z10 processor cache subsystem microarchitecture. IBM J. Res. Dev. 53(1): 2 (2009) - 2004
- [j3]Pak-kin Mak, Gary E. Strait, Michael A. Blake, Kevin W. Kark, Vesselina K. Papazova, A. E. (Rick) Seigler, Gary A. Van Huben, Liyong Wang, George C. Wellwood:
Processor subsystem interconnect architecture for a large symmetric multiprocessing system. IBM J. Res. Dev. 48(3-4): 323-338 (2004)
1990 – 1999
- 1999
- [j2]Paul R. Turgeon, Pak-kin Mak, Michael A. Blake, Michael F. Fee, Carl B. Ford III, Patrick J. Meaney, A. E. (Rick) Seigler, William Wu Shen:
The S/390 G5/G6 binodal cache. IBM J. Res. Dev. 43(5): 661-670 (1999) - 1997
- [j1]Pak-kin Mak, Michael A. Blake, Christine C. Jones, Gary E. Strait, Paul R. Turgeon:
Shared-cache clusters in a system with a fully shared memory. IBM J. Res. Dev. 41(4&5): 429-448 (1997)
Coauthor Index
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