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2020 – today
- 2020
[c16]Soeren Klingner, Zhiwei Han, Yuanting Liu, Fan Fan, Bashar Altakrouri, Bruno Michel, Jonas R. M. Weiss, Arvind Sridhar, Sophie Mai Chau:
Firefighter Virtual Reality Simulation for Personalized Stress Detection. KI 2020: 343-347
2010 – 2019
- 2019
- [c15]Ulrike Pluntke, Sebastian Gerke, Arvind Sridhar, Jonas R. M. Weiss, Bruno Michel:
Evaluation and Classification of Physical and Psychological Stress in Firefighters using Heart Rate Variability. EMBC 2019: 2207-2212 - [c14]Thomas Brunschwiler, Jonas R. M. Weiss, Stephan Paredes, Arvind Sridhar, Ulrike Pluntke, Sophie Mai Chau, Sebastian Gerke, Jorge Barroso, Emanuel Loertscher, Yuksel Temiz, Patrick W. Ruch
, Bruno Michel, Sufi Zafar, Theodore G. van Kessel:
Internet of the Body - Wearable Monitoring and Coaching. GIoTS 2019: 1-6 - [i1]Ali Oskooei, Sophie Mai Chau, Jonas R. M. Weiss, Arvind Sridhar, María Rodríguez Martínez, Bruno Michel:
DeStress: Deep Learning for Unsupervised Identification of Mental Stress in Firefighters from Heart-rate Variability (HRV) Data. CoRR abs/1911.13213 (2019) - 2018
- [j6]Artem Aleksandrovich Andreev, Arvind Sridhar, Mohamed M. Sabry, Marina Zapater, Patrick W. Ruch, Bruno Michel, David Atienza:
PowerCool: Simulation of Cooling and Powering of 3D MPSoCs with Integrated Flow Cell Arrays. IEEE Trans. Computers 67(1): 73-85 (2018) - 2017
- [c13]Rahel Strässle, Sebastian Gerke, Thomas Brunschwiler, Yuksel Temiz, Jonas R. M. Weiss, Arvind Sridhar, Stephan Paredes, Emanuel Loertscher, Neil Ebejer, Bruno Michel, H.-M. Lee, C. Alvarado, Ismael Faro, T. van Kessel, Mounir Meghelli, Marc A. Taubenblatt, Sufi Zafar, Frank Libsch, Keiji Matsumoto:
Internet of the Body and Cognitive Hypervisor. CHASE 2017: 296-297 - [c12]Rahel Straessle, Yuksel Temiz, Sebastian Gerke, Jonas R. M. Weiss, Arvind Sridhar, Stephan Paredes, Thomas Brunschwiler, Emanuel Loertscher, Neil Ebejer, Bruno Michel, T. van Kessel, Ismael Faro, Sufi Zafar, Frank Libsch, Marc A. Taubenblatt, Keiji Matsumoto:
Internet of the body and cognitive companion: Enabling high-quality monitoring of patients at home. Healthcom 2017: 1-6 - 2015
- [c11]Arvind Sridhar, Mohamed M. Sabry, David Atienza:
ICCAD 2015 Contest in 3D Interlayer Cooling Optimized Network. ICCAD 2015: 912-915 - 2014
- [j5]Arvind Sridhar, Alessandro Vincenzi, David Atienza, Thomas Brunschwiler:
3D-ICE: A Compact Thermal Model for Early-Stage Design of Liquid-Cooled ICs. IEEE Trans. Computers 63(10): 2576-2589 (2014) - [j4]Arvind Sridhar, Mohamed M. Sabry, David Atienza:
A Semi-Analytical Thermal Modeling Framework for Liquid-Cooled ICs. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 33(8): 1145-1158 (2014) - [c10]Mohamed M. Sabry, Arvind Sridhar, David Atienza, Patrick W. Ruch, Bruno Michel:
Integrated microfluidic power generation and cooling for bright silicon MPSoCs. DATE 2014: 1-6 - [c9]Arvind Sridhar, Mohamed M. Sabry, Patrick W. Ruch, David Atienza, Bruno Michel:
PowerCool: simulation of integrated microfluidic power generation in bright silicon MPSoCs. ICCAD 2014: 527-534 - 2013
- [j3]Mohamed M. Sabry, Arvind Sridhar, Jie Meng, Ayse K. Coskun, David Atienza:
GreenCool: An Energy-Efficient Liquid Cooling Design Technique for 3-D MPSoCs Via Channel Width Modulation. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 32(4): 524-537 (2013) - [c8]Arvind Sridhar, Yassir Madhour, David Atienza, Thomas Brunschwiler, John Richard Thome:
STEAM: a fast compact thermal model for two-phase cooling of integrated circuits. ICCAD 2013: 256-263 - 2012
- [j2]Arvind Sridhar, Alessandro Vincenzi, Martino Ruggiero, David Atienza:
Neural Network-Based Thermal Simulation of Integrated Circuits on GPUs. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 31(1): 23-36 (2012) - [c7]Mohamed M. Sabry, Arvind Sridhar, David Atienza:
Thermal balancing of liquid-cooled 3D-MPSoCs using channel modulation. DATE 2012: 599-604 - [c6]Alessandro Vincenzi, Arvind Sridhar, Martino Ruggiero, David Atienza:
Accelerating thermal simulations of 3D ICs with liquid cooling using neural networks. ACM Great Lakes Symposium on VLSI 2012: 15-20 - [c5]David Atienza, Arvind Sridhar:
Tutorial T7A: New Modeling Methodologies for Thermal Analysis of 3D ICs and Advanced Cooling Technologies of the Future. VLSI Design 2012: 25-26 - 2011
- [c4]Mohamed M. Sabry, Arvind Sridhar, David Atienza, Yuksel Temiz, Yusuf Leblebici, S. Szczukiewicz, Navid Borhani, John Richard Thome, Thomas Brunschwiler, Bruno Michel:
Towards thermally-aware design of 3D MPSoCs with inter-tier cooling. DATE 2011: 1466-1471 - [c3]Alessandro Vincenzi, Arvind Sridhar, Martino Ruggiero, David Atienza:
Fast thermal simulation of 2D/3D integrated circuits exploiting neural networks and GPUs. ISLPED 2011: 151-156 - 2010
- [j1]José L. Ayala, Arvind Sridhar, David Cuesta:
Thermal modeling and analysis of 3D multi-processor chips. Integr. 43(4): 327-341 (2010) - [c2]Arvind Sridhar, Alessandro Vincenzi, Martino Ruggiero, Thomas Brunschwiler, David Atienza:
3D-ICE: Fast compact transient thermal modeling for 3D ICs with inter-tier liquid cooling. ICCAD 2010: 463-470
2000 – 2009
- 2009
- [c1]José L. Ayala, Arvind Sridhar, Vinod Pangracious, David Atienza, Yusuf Leblebici:
Through Silicon Via-Based Grid for Thermal Control in 3D Chips. NanoNet 2009: 90-98
Coauthor Index
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