http://rdf.ncbi.nlm.nih.gov/pubchem/patent/AT-13462-U1
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_dc023c4f8e5024d2b0873152f8aebd0a |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T156-17 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-30 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-0152 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-36 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-0058 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-007 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B22D47-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B22D18-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-0097 |
| classificationIPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-30 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K13-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-00 |
| filingDate | 2011-03-29^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2013-12-15^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | AT-13462-U1 |
| titleOfInvention | METHOD OF MANUFACTURING, PARTICULARLY EDITING OR FITTING, A PCB ELEMENT AND SUPPORT FOR USE IN SUCH A METHOD |
| abstract | In a method for producing, in particular processing or equipping a printed circuit board element, the following steps are provided: providing a substantially full-surface carrier (1) with an adhesive surface (6), arranging and fixing a starting material of the produced, in particular to be machined or to be assembled printed circuit board element (2, 3, 4, 5) on the adhesive surface (6) of the carrier (1), - manufacture, in particular processing or loading, of the printed circuit board element (2, 3, 4, 5) fixed in on the carrier (1) fixed position, and-removing the manufactured, in particular machined or equipped printed circuit board element (2, 3, 4, 5) of the carrier (1). In addition, a carrier (1) for use in such a method Provided provided, in particular, can be dispensed with expensive separation or separation steps of printed circuit board elements (2, 3, 4, 5) and under Sc Resource re-use by a reusability of a carrier (1) cost savings in the production of printed circuit board elements (2, 3, 4, 5) can be achieved. |
| priorityDate | 2011-03-29^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
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