http://rdf.ncbi.nlm.nih.gov/pubchem/patent/AU-2013328110-A1

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filingDate 2013-10-10^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a8b1f105722f3241cf7a5573b0a0612f
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publicationDate 2015-04-30^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber AU-2013328110-A1
titleOfInvention Thermal expansion resin composition
abstract [Problem] To provide a thermal expansion resin composition which gives molded bodies having excellent flame resistance and stress at break, and relatively low elasticity. [Solution] This thermal expansion resin composition contains an epoxy resin, a thermally expandable graphite, and an inorganic filler. The epoxy compound contained in the epoxy resin contains a brominated epoxy compound, and contains, in addition to the brominated epoxy compound, a bisphenol-type epoxy compound and/or an aliphatic epoxy compound, wherein the weight ratio of the brominated epoxy compound to the bisphenol-type epoxy compound and/or aliphatic epoxy compound is in the range 99:1-1:99. This thermal expansion resin can be applied in refractory coating materials for pillars, beams and walls, in fireproof
priorityDate 2012-10-11^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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