| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_33b111c38f7584aee157fc330d9e16f5 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T29-49826
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T29-494 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01F1-8404
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01F15-006
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01F1-8427
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01F1-849
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01F1-8495
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01F1-8409
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01F1-84
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01F1-8477
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01F1-8413 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01F1-84
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01F1-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01F15-00 |
| filingDate |
2002-11-19^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_be9fdcfedf276da70914d067046def6e
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7a772e503c7fd26a12abfbd74d19980e
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f4c84bab9ccdc879ed5f22bb3ec4ef75
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_57c0fb6205fc7054cf9924ad09a5562b
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a07196d9ce31a8a53559139d799a9c19 |
| publicationDate |
2018-12-04^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
BR-PI0214393-B1 |
| titleOfInvention |
Method for manufacturing a flow meter and flow meter |
| abstract |
"Method of manufacturing a module comprising at least one electronic component". The present invention proposes a method for manufacturing low cost electronic modules, allowing a large scale production. This objective is achieved by a method for manufacturing an electronic module comprising at least one electronic component (4) and a binder layer, the electronic component (4) has a visible face on the module surface characterized by the fact that place a frame (3) on a protective sheet (2) placed on a base plate (1). At least one electronic component (4) is then placed on the protective sheet (2) and inside the frame (3). a pressing plate (6) is supported on the frame contour (3) prior to the introduction of a binder through the holes (5) drilled in the frame (3). This binder encapsulates the electronic component (4) by filling the space defined by the frame (3), the protective sheet (2) and the pressing plate (6). After solidification of the binder, the base plate (1) and the press plate (6) are removed. |
| priorityDate |
2001-11-26^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |