| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_152ca493031abf008dea905dc49310e2 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01C17-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01C7-00 |
| filingDate |
1990-06-01^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_2348160f30bcae9714ce41bdd178e413
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8330e851be326d4d9ba87e0b9894321a
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_420d8f223ee35434436045a452199abe |
| publicationDate |
1991-02-07^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
CA-2018113-A1 |
| titleOfInvention |
Layered thick film resistors and method of producing the same |
| abstract |
Abstract of the Disclosure Layered thick film resistors are formed by printing unitary resistor elements coextensively with dielectric platforms formed on a ceramic substrate. The use of a dielectric platform improves resistor geometry by raising the level of the printing surface above the nearby conductor lines and dielectric lines. The dielectric platform can be formed by various processes such as a thick film printing process, a green tape cofire process, or molding of the dielectric platform into the unfired ceramic substrate. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2009012239-A2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2009012369-A2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2009012369-A3
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8061402-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8070899-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8089337-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2009012239-A3
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9486988-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8557082-B2 |
| priorityDate |
1989-08-07^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |