http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CA-2046202-C
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_f75c33ae35e5d1dc4b05e62ec461c17f |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T29-4921 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-244 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-24 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-34 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-09 |
| filingDate | 1991-07-04^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 1997-06-10^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_fb1daf3243f9dda767a84f97f66fe08c http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_51da377998886d8b1041f4a5a15a0c22 |
| publicationDate | 1997-06-10^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | CA-2046202-C |
| titleOfInvention | Method for fabricating printed circuits |
| abstract | Conductive copper areas of printed circuits, such as through-holes, pads and lands, to which electronic components can thereafter be electrically connected by, e.g., wave soldering, are provided with a coating of nickel or cobalt, such as by electroless deposition from nickel-or cobalt-boron and nickel-or cobalt-phosphorous plating baths, or entirely or partly electrolytically, followed by a coating of a protective material which protects the nickel or cobalt coating from oxidation prior to the subsequent solder connection operation, is wettable by solder in the subsequent solder connection operation, and substantially dissolves in the solder in the subsequent solder connection operation without adverse effect on the solder joint between the electronic component and the through-hole, pad or land. A parti-cular preferred protective material is gold, such as applied by deposition from immersion or electroless gold plating baths. The invention renders the so-treated areas readily susceptible to the soldering of components thereat, thereby avoiding the need for hot air solder levelling. |
| priorityDate | 1990-09-12^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
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