| abstract |
A composition and adhesive film of a thermosetting resin and a terpolymer of an .alpha.-olefin, carbon monoxide and an ethylenically unsaturated carboxylic ester monomer, wherein the melt temperature of the terpolymer is less than the set temperature of the thermosetting resin. The film may be applied to a substrate to provide for an adhesive backing. The film may also be utilized to adhesively bond first and second substrates together. |