http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CA-2305106-C
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_533029e84a60c2988bba3bc14cc64f34 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B24B37-24 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B24B37-22 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B24B29-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B24B37-24 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B24B37-22 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B24D13-14 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-304 |
| filingDate | 2000-04-13^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2008-07-08^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4bd72681166a2b36692298cc4063d301 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f842efe415160b29b685b1f684b7d91c http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a03dbc4ad2c09e7a4b81ad4a75146ffc http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d70bb63c3203d672014ebf11c416b329 |
| publicationDate | 2008-07-08^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | CA-2305106-C |
| titleOfInvention | Polishing pads useful in chemical mechanical polishing of substrates in the presence of a slurry containing abrasive particles |
| abstract | A polishing pad for polishing semiconductors and other planar substrates in the presence of a slurry comprising abrasive particles and a dispersive agent is disclosed. The polishing pad includes a soluble component, preferably fibrous, within a polymer matrix component. The fibrous component includes fibers soluble in the slurry sufficiently to provide a void structure in the polishing surface of the pad. The void structure enhances the polishing rate and uniformity by increasing the mobility of the abrasive particles while reducing scratching of the polished surface. Additives that further enhance polishing and/or assist in the removal of residues generated during polishing, such as surfactants and removers, are optionally incorporated in the fibrous substance or topographically coated on the fibrous substance. |
| priorityDate | 1999-04-13^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
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