| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_ccfba36bede615686c297ad796fcc3ab |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B24D3-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B24D18-0054
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23D61-185
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B24D18-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23D61-18
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23D65-00 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B24D18-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B24D11-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23D65-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B28D5-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B24B27-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B24D3-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B24D3-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23D61-18
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B24D3-06 |
| filingDate |
1999-03-02^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2004-08-24^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_210174cee30bca35b3d567148bfb508e
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_92952a3012e9e9cfa52dd62cffa2695f
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9ee5e3a565203958a5df3406ed072590 |
| publicationDate |
2004-08-24^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
CA-2322421-C |
| titleOfInvention |
Superabrasive wire saw and method for making the saw |
| abstract |
A wire saw has a small diameter metal wire and a layer of abrasive grains firmly affixed to the wire surface by a brazed or soldered active metal bond. Preferably, the grains are present in a single layer. The grains are disposed on the surface of the wire in a preselected surface distribution. The wire saw can be made by a completely continuous process involving coating the wire with a paste of metal bond powder components combined with a fugitive liquid binder component. Abrasive grains are deposited into a layer of the paste. Thereafter, the bond composition is fused at a elevated temperature to braze the grains to the wire. The abrasive grains can include superabrasive materials, such as diamond and cubic boron nitride. Accordingly, the novel wire saw is suitable for cutting ultra thin wafers ceramic wafers with minimum waste of the work piece. |
| priorityDate |
1998-03-11^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |