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filingDate 2000-11-26^^<http://www.w3.org/2001/XMLSchema#date>
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publicationDate 2001-06-14^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber CA-2394458-A1
titleOfInvention Methods for producing packaged integrated circuit devices & packaged integrated circuit devices produced thereby
abstract This invention discloses a crystalline substrate based device including a crystalline substrate (102) having formed thereon a microstructure (100); an d at least one packaging layer (106) which is sealed over the microstructure b y means of an adhesive and defines therewith at least one gap between the crystalline substrate (102) and the at least one packaging layer (106). A method of producing a crystalline substrate based device is also disclosed.< /SDOAB>
priorityDate 1999-12-10^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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