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filingDate 2007-12-05^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 2013-04-30^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_61ca9232a875c78858b5d9843d8992c6
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3230526eceb860b6584edeb1f1b60328
publicationDate 2013-04-30^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber CA-2613688-C
titleOfInvention Resin bonded sorbent
abstract The invention relates to improved resin bonded sorbent compositions and articles of manufacture fabricated therewith, such as housings, structural components and circuit boards. The introduction of sorbents into resinous molding compositions enables the elimination of more conventional bagged sorbent containments. The novel molding compositions of the invention and parts fabricated therewith are multi-functional, beneficially combining structural, mechanical and adsorptive capabilities without requiring the usual reinforcing additives. Consequently, with the omission of reinforcing additives the novel molding compositions of the invention are further characterized by higher adsorptive capacities by allowing for higher sorbent loading factors than prior adsorbent-containing molding compositions.
priorityDate 2006-12-07^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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