abstract |
A flexible substrate 10 of the present invention is the flexible substrate comprising a first resin film 1 having flux activity and a second resin film 2 different from the first resin film 1 laminated to said first resin film. The flexible substrate 10 is characterized in that the flexible substrate 10 is used by having a plurality of electronic components mounted on the surface of the first resin film 1, and thereafter having the respective electronic components and the flexible substrate 10 bonded at one time. The gel time of the first resin film 1 at 230°C is 100 seconds or more and 600 seconds or less. |