| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b5231c81de1a546c1d6a9325c10910ce |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0002
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81C2203-0109
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81B2201-0207
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81C2203-035 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-562
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81B7-0051 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B81C1-00 |
| filingDate |
2014-08-11^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_2d2812775de5d50056d9cedbe420224f
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1036eefa165039891e8d18a9c16be778
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_10da3040cacf57bff775325c7691196d
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_40d46568f73e23433c518cb5b7d7d285
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_dccc5885bb96641457cd91ab4e982514
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8a41ed737ebfb1a9853c6c8fa797800e |
| publicationDate |
2016-02-18^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
CA-2946526-A1 |
| titleOfInvention |
Hermetically sealed package having stress reducing layer |
| abstract |
A sealed package having a device 102 disposed on a wafer structure and a lid structure 108 bonded to the device wafer. The device wafer includes: a substrate 104; a metal ring 107DW disposed on a surface portion of substrate around the device and a bonding material 118 disposed on the metal ring. A first layer of the metal ring includes a stress relief buffer layer 109DW having a higher ductility than that of the surface portion of the substrate and a width greater than the width of the bonding material. The metal ring extends laterally beyond at least one of the inner and outer edges of the bonding material. The stress relief buffer layer has a coefficient of thermal expansion greater than the coefficient of expansion of the surface portion of the substrate and less than the coefficient of expansion of the bonding material. |
| priorityDate |
2014-08-11^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |