http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-102105623-B
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_8a8bad24c6088d7a1deaa523dd4cfff7 |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D5-627 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D5-12 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D3-62 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D3-48 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D5-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D5-12 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D3-62 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D7-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01R13-03 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D3-48 |
| filingDate | 2009-05-12^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2013-10-02^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_abf113d9f54b410845c666b3f26cdd2c http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_bdcca1ae1053fd0479f4feaa6a04c0ee http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1b2fea86742aea9d50a06bc4f7aed25a http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4bc6fedca3ee855419f5d9e4a6847578 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ba8ff8f4b2b7e52daa49f14f4888bda7 |
| publicationDate | 2013-10-02^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | CN-102105623-B |
| titleOfInvention | Electrolytic gold plating solution and gold film obtained using same |
| abstract | The problem is to provide an electrolytic gold plating solution suitable for nickel barrier plating while maintaining the excellent properties of the gold plating film, e.g., mechanical characteristics, corrosion resistance, and electrical characteristics, that is, the problem is to provide an electrolytic gold plating solution capable of manufacturing a stable product that limits gold depositionat 'portions not requiring gold plating (nickel barrier portions)' where members are mechanically constrained, and ensures satisfactory gold deposition in portions requiring gold plating, without extraneous deposition of the gold. The aforementioned problem is solved by means of an electrolytic gold plating solution that contains a gold cyanide salt as the gold source, and a heterocyclic compoundhaving one or more nitrogen atoms in the ring and one or more nitro groups replacing a carbon atom in said ring, and by means of a gold film that is obtained by electrolytic gold plating onto a nickel film using the aforementioned electrolytic gold plating solution. |
| priorityDate | 2008-06-11^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
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