| abstract |
The present invention relates to chip arrangements and methods of forming the same, chip packages and methods of forming the same. A chip arrangement is provided, comprising: a first chip carrier; a second chip carrier; a first chip electrically connected to the first chip carrier; a second chip arranged above the first chip carrier and connected to the first chip carrier A chip carrier is electrically isolated; and a third chip is electrically connected to the second chip carrier; wherein at least one of the first chip and the second chip is electrically connected to the third chip. |