patent/CN-103996663-A

http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-103996663-A

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filingDate	2014-02-17^^<http://www.w3.org/2001/XMLSchema#date>
inventor	http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_346a54faa7d6eaf63167f1d3c9dfa223 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_bdec46fa453d5480f01b9bbaef1dbdd2
publicationDate	2014-08-20^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber	CN-103996663-A
titleOfInvention	Semiconductor module and method of forming same
abstract	According to an embodiment of the present invention, a semiconductor module includes a first semiconductor package having a first semiconductor die disposed in a first encapsulant. Openings are provided in the first encapsulant. A second semiconductor package including a second semiconductor die is disposed in the second encapsulant. The second semiconductor package is at least partially disposed within the opening in the first encapsulant.
isCitedBy	http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-107221519-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2017113921-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-106935517-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-107799511-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-106935517-B http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-106920781-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-115039220-B http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-115039220-A
priorityDate	2013-02-18^^<http://www.w3.org/2001/XMLSchema#date>
type	http://data.epo.org/linked-data/def/patent/Publication

Incoming Links

Predicate	Subject
isDiscussedBy	http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID16213861 http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID450373515

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