| abstract |
A kind of substrate board treatment and method are disclosed, which is used to improving the uniformity of thin film deposited on substrate, and control the quality of thin film, wherein, described device includes：Processing chamber housing；Substrate support, for supporting at least one substrate, wherein the substrate support is arranged on the bottom of the processing chamber housing；In the face of the Pit cover of the substrate support, the Pit cover is used for the upside for covering the processing chamber housing；And gas distributor, for the source edema caused by disorder of QI of activation is fitted on the substrate in its fixed position, wherein described gas distributor faces the substrate support in its fixed position, the gas distributor is arranged in the Pit cover, wherein described gas distributor forms gas to form plasma by using plasma, and by the source edema caused by disorder of QI is fitted on for forming a part of heating region of plasma activating the source gas. |