http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-104518159-A

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filingDate 2013-09-29^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_18fb27636b9a39a324b4af8f45f6f039
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_fb48fe5d8f90ebdcdf0f0dd0349349f1
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publicationDate 2015-04-15^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber CN-104518159-A
titleOfInvention Encapsulation structure and encapsulation method of organic light emitting diode device
abstract The invention discloses an encapsulation structure of an organic light emitting diode device. The encapsulation structure includes an anode electric conduction substrate as well as an organic light-emitting functional layer, a cathode and a thin film encapsulation layer which are sequentially stacked on the anode electric conduction substrate, wherein the thin film encapsulation layer includes germanium oxycarbide film layers and inorganic barrier layers which are sequentially stacked on the cathode, wherein the germanium oxycarbide film layers are made of a germanium oxycarbide compound, and the inorganic barrier layers are made of B2O3:Cl, Al2O3:Cl, Ga2O3:Cl, In2O3:Cl or Tl2O3:Cl. The thin film encapsulation layer in the encapsulation structure of the invention has very high density, and therefore, with the thin film encapsulation layer adopted, erosion of organic compounds and electrodes in the organic light emitting diode device which is caused by matters such as oxygen and water vapor can be effectively reduced, and therefore, the service life of the device, especially a flexible device can be prolonged, the service life of the device can reach more than 13900 hours (T70@1000cd/m<2>). The invention also provides an encapsulation method of an organic light emitting diode device.
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-111785857-A
priorityDate 2013-09-29^^<http://www.w3.org/2001/XMLSchema#date>
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