| abstract |
The present invention relates to a pressure sensor package with a stacked die arrangement. The pressure sensor package includes a pressure sensor including a first side having a pressure sensor port, a second side opposite the first side, and electrical contacts. A logic die stacked on the pressure sensor has a first side attached to the second side of the pressure sensor and a second side opposite the first side having electrical contacts. The logic die is laterally offset from the electrical contacts of the pressure sensor and is operable to process signals from the pressure sensor. Electrical conductors connect the electrical contacts of the pressure sensor to the electrical contacts of the logic die. The molding compound encapsulates the pressure sensor, the logic die, and the electrical conductors, and has an opening defining an open channel to the pressure sensor port. External electrical contacts are provided at one side of the pressure sensor package. |