http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-104944360-B
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81B2201-0235 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81C2203-01 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81B2207-07 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81B2207-096 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81B2201-0264 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81B7-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01L9-0042 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01P15-125 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81B7-007 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01P15-0802 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81C1-0038 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01L9-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B81B7-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B81C1-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01P15-08 |
| filingDate | 2014-03-25^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2017-05-17^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2017-05-17^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | CN-104944360-B |
| titleOfInvention | MEMS (Micro Electro Mechanical System) device and forming method thereof |
| abstract | The invention relates to an MEMS (Micro Electro Mechanical System) device and a forming method thereof. The MEMS device comprises a substrate, a first dielectric layer, a second dielectric layer, a plurality of first metallic plugs and a pressure sensor, wherein an integrated circuit is formed in the substrate; the first dielectric layer is located on the substrate, and a plurality of first metallic connecting terminals and second metallic connecting terminals are formed in the first dielectric layer and are electrically connected with the integrated circuit; the second dielectric layer is located on the first dielectric layer, and an acceleration sensor is formed in the second dielectric layer and is electrically connected with the first metallic connecting terminals; the first metallic plugs are located in the second dielectric layer and are electrically connected with the second metallic connecting terminals; the pressure sensor is located on the second dielectric layer and is electrically connected with the first metallic plugs. The MEMS device disclosed by the invention has the advantages that the integration of the pressure sensor and the acceleration sensor is realized, and the size of the MEMS device is relatively small. |
| priorityDate | 2014-03-25^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Showing number of triples: 1 to 37 of 37.