http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-105228364-B

Outgoing Links

Predicate Object
classificationCPCAdditional http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-025
classificationCPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-28
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-0091
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-064
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-1216
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-00
classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-28
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-00
filingDate 2015-10-30^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 2018-07-24^^<http://www.w3.org/2001/XMLSchema#date>
publicationDate 2018-07-24^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber CN-105228364-B
titleOfInvention Package substrate resistance welding processing method
abstract The present invention relates to a kind of package substrate resistance welding processing methods, including step:The first printing, in the surface printing first layer solder mask of core plate;It opens a window for the first time, in first layer solder mask uplifting window, obtains the first windowing;The surface of grinding, grinding first layer solder mask is allowed to smooth;The second printing prints second layer solder mask on first layer solder mask and first windowing;Second of windowing obtains the second windowing in second layer solder mask uplifting window, and second windowing is located in the first windowing range.By the way of printing solder mask twice, opening a window twice, the flatness error of second layer solder mask on first layer solder mask outer surface is less than micron level, and, windowing again is carried out to the second layer solder mask in the first windowing range and obtains the second windowing, prints not the windowing influenced on package substrate twice.
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-111065212-B
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-111065212-A
priorityDate 2015-10-30^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

Incoming Links

Predicate Subject
isDiscussedBy http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID23978
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID418354341

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