| Predicate |
Object |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K2103-12 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G02B7-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03B3-10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K1-0016
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G02B7-09
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K1-19
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D3-562
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C22C9-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D5-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K1-008
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D3-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03B13-36
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D5-60 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C14-06 |
| filingDate |
2016-01-06^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2020-01-14^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate |
2020-01-14^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
CN-105779809-B |
| titleOfInvention |
Titanium-copper with plating and electronic components provided with the titanium-copper |
| abstract |
The present invention provides a titanium copper which can improve the sealing strength with solder. The base material of the titanium-copper has the following composition: it contains 1.5 to 5.0 mass % of Ti and the remainder is composed of copper and inevitable impurities, and the base material has a surface selected from the group consisting of Ni plating, Co plating, and Co-Ni alloy plating. The plating in the group. |
| priorityDate |
2015-01-09^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |