http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-105834542-B
Outgoing Links
| Predicate | Object |
|---|---|
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K1-018 |
| filingDate | 2015-01-13^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2019-05-07^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2019-05-07^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | CN-105834542-B |
| titleOfInvention | A kind of dual-in-line package chip provision for disengagement |
| abstract | The present invention relates to a kind of dual-in-line package chip provision for disengagement, solve the problems, such as that dual-in-line package chip is quick during circuit board repair, nondestructive demounting is difficult.The device includes circuit board fixed cell (1), molten tin bath unit (2), heating temperature control unit (3), positioning unit (4), operation display unit (5) and frame (6,7,9,10).The device is easy to operate, can from circuit board quickly, the dual-in-line package chip of nondestructive demounting difference pin. |
| priorityDate | 2015-01-13^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
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