http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-106373947-B
Outgoing Links
Predicate | Object |
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classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-1034 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-10295 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L25-162 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-10371 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-117 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L25-18 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-10424 |
classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0216 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-24 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-3675 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L25-0655 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-562 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L25-072 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-373 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-42 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-057 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-49838 |
classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-373 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L25-07 |
filingDate | 2016-07-22^^<http://www.w3.org/2001/XMLSchema#date> |
grantDate | 2019-05-14^^<http://www.w3.org/2001/XMLSchema#date> |
publicationDate | 2019-05-14^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber | CN-106373947-B |
titleOfInvention | Robust High Performance Semiconductor Packaging |
abstract | The present application relates to robust high performance semiconductor packaging. A semiconductor package includes a suspended substrate having one or more semiconductor devices thereon; a metal casing covering the suspended substrate; the suspended substrate supported by a plurality of mechanical leads on opposite sides of the semiconductor package; a plurality of mechanical At least one of the leads has a CTE that substantially matches a coefficient of thermal expansion (CTE) of the suspension substrate, wherein at least one of the plurality of mechanical leads is electrically connected to the suspension substrate, and wherein the plurality of mechanical leads absorbs mechanical shock , in order to prevent damage to the semiconductor package. The semiconductor package also includes a thermal gel between the suspended substrate and the metal housing. The suspended substrate may be a printed circuit board. The metal housing includes mounting lugs for transferring heat away from the semiconductor package. |
priorityDate | 2015-07-24^^<http://www.w3.org/2001/XMLSchema#date> |
type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
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