| abstract |
Semiconductor device and manufacturing method thereof. A semiconductor package and a manufacturing method thereof capable of reducing the size of the semiconductor package and improving product reliability. In a non-limiting example embodiment, the method may include forming an interposer on a wafer, forming at least one stiffener on the interposer, coupling and electrically connecting at least one semiconductor die to the interposer, with A primer fills the area between the semiconductor die and the interposer, and an encapsulant is used to encapsulate the reinforcement features, the semiconductor die, and the primer on the interposer. |