| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_36f8253f3d0d59bcd9259217d4385d10 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H10N52-80
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01R33-0005
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01R33-0052
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01R33-09
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H10N52-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H10N50-10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H10N50-01
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H10N50-80
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01R33-07
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01R33-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L25-04 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01R33-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01R33-02 |
| filingDate |
2017-06-08^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0c0a025b14722046e40dc0dbef6b8850
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b8f516f806d0eff1a021ee9c7ff5df71
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_463ddcd70e2992f4dc24bbd7c9ae4f14 |
| publicationDate |
2017-12-15^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
CN-107479008-A |
| titleOfInvention |
Chip package, manufacturing method and operation method thereof, and chip packaging system |
| abstract |
A chip package, a chip packaging system, a method of manufacturing a chip package, and a method of operating a chip package comprising: configured to measure a magnetic field up to a maximum magnetic field value are disclosed A first sensor of a component; a second sensor configured to measure a magnetic field component exceeding a maximum magnetic field value; and coupled to the first sensor and the second sensor and configured to receive from at least one of the first sensor and the second sensor A circuit for at least one sensor signal, wherein the circuit is further configured to select either the first sensor or the second sensor to measure the magnetic field component based on the received sensor signal. |
| priorityDate |
2016-06-08^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |