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filingDate 2017-03-28^^<http://www.w3.org/2001/XMLSchema#date>
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publicationDate 2018-05-08^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber CN-108012564-A
titleOfInvention Semiconductor device
abstract The present invention relates to a semiconductor device comprising: a first semiconductor element formed on an adherend; and an adhesive film for embedding the first semiconductor element, wherein the adhesive film satisfies melt viscosity and weight at a high temperature A predetermined ratio between loss rates.
priorityDate 2016-03-28^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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