| abstract |
A semiconductor package is described that meets a plurality of predetermined electrical, mechanical, chemical and/or environmental requirements. The semiconductor package includes an insert-molded plastomer or a semiconductor die covered by a molded plastomer that meets only a subset of the plurality of predetermined electrical, mechanical, chemical, and/or environmental requirements set. The semiconductor package also includes a plurality of terminals extending from the molded plastic body and electrically connected to the semiconductor die and applied to at least a portion of the molded plastic body and/or the plurality of terminals part of the coating. The coating meets each predetermined electrical, mechanical, chemical and/or environmental requirement that cannot be met by the molded plastomer. |