| Predicate |
Object |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J2301-208
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J2301-408
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J2301-312
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J2301-122
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J2203-326
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2221-68386
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2221-68327 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-67132
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J133-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J11-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-6836
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J7-20
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J7-24 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J11-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-683
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J7-24
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J133-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J161-06 |
| filingDate |
2018-04-16^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2022-07-12^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate |
2022-07-12^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
CN-108727999-B |
| titleOfInvention |
Die-bond film |
| abstract |
To provide a dicing die-bonding film that can satisfactorily cut an adhesive layer on a dicing tape in an extended process of using the dicing die-bonding film to obtain a semiconductor chip with an adhesive layer A semiconductor chip with an adhesive layer enables good pickup. A dicing die-bonding film comprising: a dicing tape having a laminated structure including a base material and an adhesive layer; and an adhesive layer releasably adhering to the adhesive layer in the dicing tape , the elastic modulus of the surface of the adhesive layer is 0.1-20 MPa when the surface of the adhesive layer is pressed into 500 nm by the nano-indentation method under the conditions of a temperature of 23° C. and a frequency of 100 Hz. |
| priorityDate |
2017-04-17^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |