http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-109103318-B
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-97 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2933-0033 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2933-0066 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48091 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48257 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48247 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L33-483 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-043 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L33-486 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L33-52 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L33-22 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-4875 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-3157 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L33-62 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L33-48 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L33-62 |
| filingDate | 2018-06-20^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2020-06-12^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2020-06-12^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | CN-109103318-B |
| titleOfInvention | Light emitting diode packaging structure |
| abstract | A light emitting diode package structure includes a first metal plate, a second metal plate, and a mold. The first metal plate is provided with at least one first protruding part. The second metal plate is provided with at least one second protruding part. The die is disposed on the first metal plate and the second metal plate, wherein the die has a first side surface, a second side surface opposite to the first side surface, a third side surface, and a fourth side surface opposite to the third side surface, wherein the first protrusion and the second protrusion protrude from the first surface and the second surface, respectively, and the first metal plate and the second metal plate are covered with the third side surface and the fourth side surface, wherein the first side surface and the third side surface intersect at a first edge, and a portion of the first side surface between the first edge and the first protrusion is a fracture surface. The design of the present disclosure improves the structural strength, so that the stamping structure can be prevented from being damaged and has better yield, and the cutting process can be performed without cutting the lead frame, thereby reducing the cost of tool consumption. |
| priorityDate | 2017-06-20^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
| Predicate | Subject |
|---|---|
| isDiscussedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID5182128 http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID419577416 |
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