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publicationDate 2019-01-04^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber CN-109155452-A
titleOfInvention High-frequency antenna structures with high thermal conductivity and high surface area
abstract In the depicted example, a heat dissipating antenna (320) includes a low attenuation heat spreader (202) coupled to a high frequency antenna or antenna array (112). The integrated circuit (100) includes a wireless integrated circuit chip (108). The heat dissipation antenna (320) is coupled to the wireless integrated circuit chip (108).
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