http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-109179312-B

Outgoing Links

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classificationCPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C14-24
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http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81C1-00388
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classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C14-58
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http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B81C1-00
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http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C14-24
filingDate 2018-08-03^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 2019-09-24^^<http://www.w3.org/2001/XMLSchema#date>
publicationDate 2019-09-24^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber CN-109179312-B
titleOfInvention A kind of preparation method of pattern metal film
abstract The invention discloses a kind of preparation methods of pattern metal film, comprising the following steps: (1) plates one layer of metallic film in silicon substrate surface using vacuum evaporation technology;(2) in one layer of ultraviolet optical cement of metal film surfaces spin coating;(3) make ultraviolet light adhesive curing using photoetching technique, then remove uncured ultraviolet optical cement using developer solution;(4) prepolymer is poured on sample surfaces, it is made to solidify and closely be combined together with exposed metallic film under conditions of negative pressure;(5) thin polymer film is vertically removed from silicon chip, patterned metal Ag films is made to be transferred to PDMS film surface from silicon substrate surface.The controllability of preparation process can be improved in the present invention, improves patterned precision, keeps preparation process simple and easy;The use for reducing chemical reagent, reduces the generation of chemical waste, keeps preparation process more environmentally-friendly, experimenter's operating environment is more healthy;Reagent needed for reducing preparation, reduces cost.
priorityDate 2018-08-03^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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