http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-109262099-A

Outgoing Links

Predicate Object
assignee http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_c50a4f21d4c844bdb8bb98ceebbe7f21
classificationCPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K3-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K1-018
classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K1-018
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K3-00
filingDate 2018-09-26^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ba662e7250f93dce773fd1599f7777ce
publicationDate 2019-01-25^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber CN-109262099-A
titleOfInvention Circuit board component disassembling device for recycling soldering tin used for household appliances
abstract The invention discloses a circuit board component disassembling device for recycling solder solder used by household appliances, and the structure thereof comprises: a pressing cap, a U-shaped chute, a piston rod, a clip sleeve, a pneumatic inner cavity groove and a double groove The suction cap, the needle tube and the spring tube holder are fastened together with the pneumatic inner cavity slot through the double groove suction cap and penetrated each other, the double groove suction cap is welded integrally with the needle tube, and the double groove suction cap is nested in the pneumatic The left side of the inner cavity groove, the invention realizes the use of the double groove suction cap and the spring tube frame, the solder is heated by the electric soldering iron to form the solder liquid into the double-mouth slotted ellipsoid inner tube, and then the solder is subjected to the electric heating plate The secondary heating effect, in the subsequent bending of the rotating plate to withstand the solder liquid pressure and counteracting the rotating thrust, so that the solder liquid enters the S-shaped tube shaping output to the spring tube frame, because the spring tube frame stretches the solder cooling lumps to form a thin strip output, Achieve simple and convenient secondary recovery of solder to fully absorb and process the treatment effect.
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-114427030-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-112051537-A
priorityDate 2018-09-26^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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Predicate Subject
isDiscussedBy http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID23925
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID419524915
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID419491185
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID5352426

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