http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-109273450-A

Outgoing Links

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assignee http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_f80f7502fa29eccce5d0ca3b654f4d96
classificationCPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H10B41-20
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H10B43-40
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H10B41-41
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H10B43-20
classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L27-11529
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L27-11573
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L27-11578
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L27-11551
filingDate 2018-09-04^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d798f0aadd7daf19f7be928539932f7e
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7ee32f926474e95a607b9118110f4f4e
publicationDate 2019-01-25^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber CN-109273450-A
titleOfInvention Three-dimensional memory manufacturing method
abstract The present invention relates to the field of semiconductor manufacturing technology, and in particular, to a method of manufacturing a three-dimensional memory. The method for fabricating a three-dimensional memory includes the steps of: providing a substrate; forming a conductive connection pad over the substrate; forming a bit line over the conductive connection pad, the end of the bit line being perpendicular to The direction of the substrate is electrically connected to the conductive connection pad; an upper layer wire is formed over the bit line, and an end of the upper layer wire is electrically connected to the conductive connection pad in a direction perpendicular to the substrate . The invention avoids the problem that the upper layer conductor is easily misaligned when the upper layer conductor is connected with the bit line due to the narrow line width of the bit line, avoids the mutual influence between the adjacent bit lines, and improves the performance of the three-dimensional memory.
priorityDate 2018-09-04^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

Incoming Links

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http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID23964

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