| Predicate |
Object |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B2457-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08J2323-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B2307-302
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K2201-001
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L23-16 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B27-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B27-20
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-3737
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08J3-24
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08F210-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K3-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K3-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K3-042
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08F220-1818
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L101-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L23-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L23-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L33-08 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08F210-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L23-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L101-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08J3-24
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B27-20 |
| filingDate |
2017-06-13^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2021-07-02^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate |
2021-07-02^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
CN-109312167-B |
| titleOfInvention |
Resin composition and use thereof |
| abstract |
The invention provides a resin composition capable of obtaining a heat-radiating sheet with high effect of inhibiting temperature rise caused by heat generation of an electronic component (element). Specifically disclosed is a resin composition containing a polymer (1) and a thermally conductive material (3), wherein the polymer (1) has a melting enthalpy of 30J/g or more as measured by differential scanning calorimetry in a temperature range of 10 ℃ or more and less than 60 ℃, the thermally conductive material (3) has a thermal conductivity of 1W/(m.K) or more, the total amount of polymer components contained in the resin composition is 100 parts by weight, and the content of the thermally conductive material (3) is 1 part by weight or more and 80 parts by weight or less. |
| priorityDate |
2016-06-15^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |