| abstract |
Dielectric materials with optimal mechanical properties are proposed for laser ablation patterning. These materials include polymers selected from the group consisting of polyureas, polyurethanes and polyhydrazones. Novel methods for preparing suitable polyhydrazones are also provided. These methods involve mild conditions and yield soluble polymers that are stable at room temperature and that can be incorporated into formulations that can be applied to microelectronic substrates. The dielectric material exhibits high elongation, low CTE, low curing temperature, and leaves little to no debris after ablation. |