| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_5d7576285d411d00c697e07270d2814a |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-1037
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-291
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-10375
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-00014
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-1033
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-10272
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48091
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48227
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-48
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48225
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-10254
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-73265
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-19107
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-29101
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-73
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-32
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-29
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-1815
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-181
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-32225 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-54
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-3735
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-3107
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-13
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-049
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-45
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-3675
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-18
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-053
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-565
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-52 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-373
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-053
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-13
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-54 |
| filingDate |
2019-01-18^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b6dc749e4ad59e55f500cbac995a5e03
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b27ce928d6b1b0990d52b48c72ec6edf
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7f30eb728c957907dfaf3cd2b3531cfd |
| publicationDate |
2019-07-30^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
CN-110071071-A |
| titleOfInvention |
Semiconductor device and method of manufacturing the same |
| abstract |
The purpose of the technology disclosed in the present specification is to provide a technology for reducing the manufacturing cost and improving the heat dissipation without reducing the mechanical strength of the resin. The semiconductor device according to the technology disclosed in the present specification includes: an insulating substrate (12); a semiconductor element (14) arranged on the upper surface of the insulating substrate; and a case (16) that accommodates the semiconductor element inside connected to an insulating substrate; and a resin (20) filled in the inner side of the case by burying the semiconductor element, a first recess (200) is formed on the upper surface of the resin inside the case, and the first recess is formed in The position of the entire semiconductor element is included in a plan view. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-110690122-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-110690122-B |
| priorityDate |
2018-01-23^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |