http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-110116266-B
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K26-702 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K26-70 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K26-00 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K26-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K26-70 |
| filingDate | 2019-04-22^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2021-04-06^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2021-04-06^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | CN-110116266-B |
| titleOfInvention | Laser processing method, device and system for ultra-long circuit board material |
| abstract | The invention relates to a laser processing method, a device and a system for an ultra-long circuit board material. The method comprises the following steps: obtaining a processing drawing file of the material of the ultra-long circuit board; dividing the ultra-long circuit board material and the processing drawing file into a plurality of blocks which are sequentially connected according to the maximum processing length of the machine station, and adding a positioning identifier corresponding to each block on the processing drawing file; when any block in the overlong circuit board is subjected to laser processing according to the processing drawing file, a positioning mark corresponding to a next block adjacent to the any block is generated on the overlong circuit board; before the next block is subjected to laser processing according to the processing drawing file, the relative position of the laser processing head device and the next block is adjusted according to the circuit board image which is obtained by the shooting device and comprises the positioning mark; and carrying out laser processing on the next block according to the processing drawing file. The technical scheme of the invention can ensure the laser processing precision of the ultra-long circuit board material based on the existing laser processing equipment. |
| priorityDate | 2019-04-22^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
| Predicate | Subject |
|---|---|
| isDiscussedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID5359268 http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID419491804 |
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