http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-110475913-B
Outgoing Links
Predicate | Object |
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classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D3-60 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D21-10 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D3-56 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D3-58 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/A44B19-26 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D5-625 |
classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D17-18 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D3-60 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D21-10 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D3-56 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D5-007 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D3-58 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D7-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D5-10 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D5-627 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D5-623 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D17-16 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D5-617 |
classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D7-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D3-56 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D5-10 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D17-16 |
filingDate | 2017-05-11^^<http://www.w3.org/2001/XMLSchema#date> |
grantDate | 2020-09-01^^<http://www.w3.org/2001/XMLSchema#date> |
publicationDate | 2020-09-01^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber | CN-110475913-B |
titleOfInvention | Electroplating method and apparatus |
abstract | The electroplating method comprises: a stirring process in which a set of substrates (51) of the electrolytic solution settled in the electroplating tank (10) is caused to flow in the circumferential direction along the inner wall (19) of the electroplating tank (10) ; and an electroplating process, in which electroplating is performed on a group of substrates (51) flowing in the circumferential direction in the electrolytic solution in the electroplating tank (10). The circumferential flow of a set of substrates (51) is caused by the circumferential flow of the magnetic medium (30) in the electrolyte in the electroplating bath (10), or with the setting to It is produced by the rotation of the stirring part (46) on the bottom side of the electroplating tank (10). At least a portion of a set of substrates (51) flowing circumferentially in the electrolyte in the electroplating bath (10) is in contact with a lower cathode (21) disposed to the bottom side of the electroplating bath (10), located at a distance higher than that in contact with The substrate (51) located above the substrate (51) of the lower cathode (21) is electrically connected to the lower cathode (21) via at least the substrate (51) in contact with the lower cathode (21). |
priorityDate | 2017-04-14^^<http://www.w3.org/2001/XMLSchema#date> |
type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
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