http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-110741109-B

Outgoing Links

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classificationCPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D3-58
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D3-38
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http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D3-58
filingDate 2018-05-31^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 2021-11-23^^<http://www.w3.org/2001/XMLSchema#date>
publicationDate 2021-11-23^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber CN-110741109-B
titleOfInvention Aqueous acid copper electroplating bath and method for electrolytic deposition of copper coatings
abstract An aqueous acidic copper electroplating bath comprising: copper ions; at least one acid; halide ions; at least one sulfur-containing compound selected from the group consisting of sodium 3-mercaptopropyl sulfonate, bis(sodium sulfopropyl) disulfide , 3-(N,N-dimethylthiocarbamoyl)-thiopropanesulfonic acid or its respective sodium salt and the mixture of above-mentioned substances; At least one amine reaction product of diethylamine and epichlorohydrin or Amine reaction products of isobutylamine and epichlorohydrin or mixtures of these reaction products; at least one ethylenediamine compound selected from the group consisting of: an ethylenediamine compound with an EO-PO-block polymer attached, Ethylenediamine compounds having attached EO-PO-block polymers and sulfosuccinate groups and mixtures thereof; at least one aromatic reaction product of benzyl chloride and at least one polyalkyleneimine, and A method of electrolytically depositing a ketone coating using the electroplating bath.
priorityDate 2017-06-16^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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