| Predicate |
Object |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H04R1-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81C2203-0109
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H04R2201-003
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H04R31-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81B2207-012
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81C2203-035
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81C2203-019
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81C2203-032
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81C2203-0118
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81B2201-0257 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81C1-00269
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H04R1-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81B7-0061
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H04R19-005
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81C1-00309
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H04R19-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H04R31-00 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H04R19-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H04R31-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H04R19-04 |
| filingDate |
2019-03-21^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2022-05-03^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate |
2022-05-03^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
CN-110868679-B |
| titleOfInvention |
Microphone packaging structure |
| abstract |
The invention discloses a microphone packaging structure, which is a microphone packaging structure of a Micro Electro Mechanical System (MEMS), and comprises a packaging substrate and an integrated circuit arranged on the packaging substrate. In addition, a MEMS microphone is disposed on the package substrate, wherein the MEMS microphone is electrically connected to the integrated circuit. The conductive adhesive layer is arranged on the packaging substrate and surrounds the integrated circuit and the MEMS microphone. The bottom of the cap structure is adhered to the conductive adhesive layer. The underfill layer is disposed on the package substrate and covers the outer side of the conductive adhesive layer. |
| priorityDate |
2018-08-27^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |