| abstract |
The electronic package includes an insulating substrate, an electronic component having a back surface coupled to a first surface of the insulating substrate, and an insulating structure surrounding at least a portion of a perimeter of the electronic component. The first wiring layer extends from the first surface of the insulating substrate and on the inclined sides of the insulating structure to electrically couple with at least one contact pad on the active surface of the electronic component. The second wiring layer is formed on the second surface of the insulating substrate and extends through at least one via hole therein to electrically couple with the first wiring layer. |