http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-111180899-B
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01Q1-50 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01Q23-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01Q1-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01Q1-38 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01Q21-0006 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01Q1-48 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01Q1-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01Q23-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01Q21-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01Q1-50 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01Q1-38 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01Q1-48 |
| filingDate | 2019-12-31^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2021-07-02^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2021-07-02^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | CN-111180899-B |
| titleOfInvention | Micro-system-based light and thin high-density integrated antenna array structure |
| abstract | The invention relates to a light, thin and high-density integrated antenna array structure based on a microsystem, wherein four-channel chip active TR components and chip power supplies are arranged in a staggered mode, are fixed on the back surface of a high-low frequency mixed-voltage printed board by adopting a high-density integrated welding process, and meanwhile, a beam control component is welded on one side of the back surface of the high-low frequency mixed-voltage printed board; and the wave beam control component, the chip power supply and the high-low frequency mixed-voltage printed board are welded and interconnected in an SMT (surface mount technology) mode. The invention realizes the high-efficiency and reliable transmission of various signals by vertically interconnecting the printed boards in a multilayer printed board laminating mode, improves the integration level of an antenna array surface to the maximum extent, reduces the volume and the weight of an effective load and improves the reliability of a system; meanwhile, the current realization level of the processes of multilayer printed board processing, component micro-assembly and the like is considered; and the antenna, the comprehensive radio frequency network, the TR component, the wave control chip and the power supply chip which meet the framework are interconnected without leads at the Ku frequency band for the first time. |
| priorityDate | 2019-12-31^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
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