http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-111463111-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_0f23f04373f26915ff7578e2cada4061 |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2223-544 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02021 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02008 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-0201 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B24D5-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-544 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K26-362 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K26-402 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-544 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K26-362 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B24D5-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K26-402 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-02 |
| filingDate | 2020-05-06^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_2410dfb98b2299102e49e0e7b532b648 |
| publicationDate | 2020-07-28^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | CN-111463111-A |
| titleOfInvention | A non-destructive single wafer whose edge is easy to identify and its marking method and special grinding wheel |
| abstract | The invention discloses a non-destructive single wafer whose edge is easy to identify, a marking method and a special grinding wheel, which belong to the technical field of semiconductor processing, and are proposed for the defect of low processing efficiency of the existing single wafer marking method. The wafer body includes an upper surface and a lower surface. On the surface, a chamfer for identification is processed at the edge of the wafer body. The chamfer includes an upper bevel and a lower bevel. The upper bevel and the lower bevel are connected by an arc-shaped fillet. is the first acute angle α, the included angle formed between the extension line of the lower surface and the lower slope is the second acute angle β, the first acute angle α is smaller than the second acute angle β, the upper slope and the lower slope are asymmetrically arranged, and the upper slope and the upper surface are arranged asymmetrically. Same diameter, with identifier engraved on the lower bevel. The marking methods include cutting processing, chamfering and edge polishing section processing, and marking processing. By processing asymmetric chamfers at the edge of the wafer body and marking the identifier, the processing damage rate is reduced and the effective utilization area is increased. |
| priorityDate | 2020-05-06^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
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