| abstract |
A device includes: a ground plane electrically connected to a proximal end of at least one conductive post; and an antenna pad substantially parallel to the ground plane, wherein the antenna pad is connected to at least one through a dielectric liner having a first dielectric constant The distal ends of one conductive post are spaced apart, wherein the ground plane, the at least one conductive post, and the dielectric liner surround the antenna cavity, the antenna cavity is filled with a dielectric fill material having a second dielectric constant that is the same as the The first dielectric constants are different. Embodiments of the present invention also relate to semiconductor devices and methods of forming the same. |