| abstract |
The invention discloses a manufacturing method of a double-sided circuit board with embedded copper blocks, which comprises the following steps: (1) Component A, component B, component C, component D, component E, component F, Component G, Component H, Component I, Component J and Component K are added successively in the container containing the organic solvent, stirring, dissolving and dispersing, to be mixed with resin composition glue; the mass parts of each component are as follows: Part A: 55-60 parts, Part B: 32-40 parts, Part C: 35-45 parts, Part D: 15-18 parts, Part E: 35-40 parts, Part F: 20 parts ‑35 parts; the resin composition obtained by applying the formula of the present invention and the circuit board prepared by the method of the present invention have excellent heat resistance, lower dielectric constant and dielectric loss factor, and better flame retardancy And bending strength, lower water absorption, suitable for 5G communication field, and the copper block is not easy to fall off, and the service life is longer. |