| abstract |
The invention discloses a semiconductor module device, comprising: a casing; a first semiconductor substrate arranged inside the casing; a second semiconductor substrate arranged inside the casing; a first plurality of controllable semiconductor elements; and A second plurality of controllable semiconductor elements. During operation of the semiconductor module arrangement, each controllable semiconductor element of the first plurality of controllable semiconductor elements generates switching losses and conduction losses, wherein the switching losses are greater than the conduction losses, and, during operation of the semiconductor module arrangement , each controllable semiconductor element of the second plurality of controllable semiconductor elements generates switching losses and conduction losses, wherein the conduction losses are greater than the switching losses. At least a first subset of the first plurality of controllable semiconductor elements is arranged on a first semiconductor substrate, and at least a first subset of the second plurality of controllable semiconductor elements is arranged on a second semiconductor substrate. |