| abstract |
The invention discloses a vehicle-mounted high-power integrated packaging module, which comprises a power module body and a plastic shell used for packaging the power module body, wherein the power module body mainly comprises a chip part, an insulating substrate, a power terminal, a signal terminal, a thermistor and a heat dissipation substrate; the chip part comprises an insulated gate bipolar transistor and a diode chip, the signal terminal, the insulated gate bipolar transistor and the diode chip are all welded on a conductive copper layer of the insulating substrate through tin soldering, and the power terminal is welded on the conductive copper layer of the insulating substrate through ultrasonic welding; the chip parts and the conducting layers of the corresponding insulating substrates are electrically connected through aluminum wire bonding. |