http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-113224039-A

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filingDate 2020-08-18^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1b6e1a50229c24b4d09fb100e9cfaecf
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publicationDate 2021-08-06^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber CN-113224039-A
titleOfInvention Chip RF packages and RF modules
abstract A chip radio frequency package and a radio frequency module are provided. The radio frequency module includes: a core member; a front end integrated circuit (FEIC); a first connection member; a second connection member provided on the upper surface of the core member; a radio frequency integrated circuit (RFIC) provided on the second on the upper surface of the connection member, and configured to input or output a fundamental signal and a first radio frequency (RF) signal through the wiring layer, the first RF signal having a frequency higher than that of the fundamental signal; a substrate, disposed on the on the lower surface of the first connection member; and an electrical connection structure configured to electrically connect the first connection member and the substrate. The FEIC is configured to input or output the first RF signal and a second RF signal, the second RF signal having a different power than that of the first RF signal.
priorityDate 2020-02-05^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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